Infineon H30R1202 IGBT Module: Datasheet, Application Circuit, and Pinout Configuration
The Infineon H30R1202 is a robust and highly efficient Insulated Gate Bipolar Transistor (IGBT) module, engineered to deliver superior performance in high-power switching applications. This module integrates two IGBTs configured in a half-bridge topology, making it an ideal solution for inverters in motor drives, industrial automation, and renewable energy systems. Its design focuses on low saturation voltage and high-speed switching, which are critical for minimizing power losses and improving overall system efficiency.
A thorough review of the datasheet is essential for proper implementation. The H30R1202 is rated for a collector-emitter voltage (V_CES) of 1200 V and a continuous collector current (I_C) of 30 A at 80°C. Key parameters include a low saturation voltage (V_CE(sat)) of typically 2.05 V, which directly contributes to reduced conduction losses. The module also features a built-in anti-parallel diode, facilitating smooth reverse current flow during inductive load switching. Critical absolute maximum ratings, such as the junction temperature range of -40°C to +150°C, must be strictly observed to ensure device longevity and reliability.
The pinout configuration of the H30R1202 is standardized for ease of integration into power boards. The module typically features multiple terminals for power and control:
Main Terminals: Collector 1 (C1), Emitter 1 (E1), Collector 2 (C2), and Emitter 2 (E2) for the high-side and low-side switches.
Gate Drive Terminals: Gate Emitter 1 (G1E1+) and Gate Emitter 2 (G2E2+) for applying the control signals to each IGBT.
Proper attention to the pinout is crucial to avoid miswiring, which can lead to immediate device failure.
Designing a reliable application circuit requires careful consideration of both the driver stage and protection mechanisms. A dedicated gate driver IC is recommended to provide the necessary voltage (typically +15V for turn-on and -5 to -15V for turn-off) and peak current to swiftly charge and discharge the IGBT's internal gate capacitance. The circuit must include:
Low-inductance busbars to minimize voltage overshoot during switching.

DC-link capacitors placed close to the module to suppress voltage spikes.
Robust snubber circuits (if required) for damping high-frequency ringing.
Overcurrent protection, often implemented using de-sat detection, and temperature monitoring via an integrated NTC thermistor.
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In summary, the Infineon H30R1202 stands out as a highly reliable and efficient power module for demanding applications. Its well-documented characteristics and standardized pinout simplify the design process. Success hinges on adhering to the datasheet's absolute maximum ratings, implementing a robust gate driving strategy, and incorporating necessary protection circuits to ensure stable and long-term operation.
Keywords:
IGBT Module
Half-Bridge Topology
Saturation Voltage
Gate Driver
Application Circuit
